The Equipment Front End Module integrates load ports, wafer-handling robots and control systems to transfer wafers between carrier pods and semiconductor process equipment.
Supports different combinations of load ports, robots and control systems.
Provides smooth movement between carriers and process equipment.
Designed for demanding semiconductor manufacturing environments.
Layouts, motion patterns and communication interfaces can be configured for different applications.
The FOPLP Load Port provides a controlled interface for loading and unloading panels between carriers and semiconductor processing equipment.
Supports secure and controlled carrier opening and closing.
Accommodates different carrier and panel configurations using interchangeable attachments.
Detects different panel types, including warped and thin panels.
Designed in accordance with applicable semiconductor equipment standards.
The PLP Panel Handling Robot provides smooth and stable panel transfer for advanced semiconductor packaging equipment.
Enables controlled movement between different process stages.
Supports flexible equipment layouts while minimising the required footprint.
Integrated controls help reduce system components and simplify installation.
Supports clean, organised and reliable robot movement.
The Wafer Handling Robot provides fast, smooth and stable wafer transfer within semiconductor manufacturing equipment.
Advanced motion control provides smooth and stable operation.
Optimised movement helps reduce wafer-transfer time.
Supports faster motion and efficient equipment operation.
Simplified connections enable easier integration with process equipment.